Soic 8 thermal resistance. Part Number: SN65LVDT34 I'm looking for the Junction to Board Thermal Resistance for SN65LVDT34D (Theta JB or Psi JB) with the SOIC 8 package. Using this method, designers can verify thermal performance in their specific applications and gain insight that will be valuable for new designs. As one might expect from a package not designed to the purpose, serious performance limitations result. 5 14 SOIC 58 26 High Efficiency Components in a Dual SOIC−8 Package High Density Power MOSFET with Low RDS(on) Miniature SOIC−8 Surface Mount Package − Saves Board Space Diode Exhibits High Speed with Soft Recovery IDSS Specified at Elevated Temperature Avalanche Energy Specified Thermal Performance of MOSFET DFN Packages The use of DFN style packages for Power MOSFETs is an obvious extension of the widespread use of QFN packages for ICs, and brings smaller yet thermally superior packages for MOSFETs. SSZTAV1 – SEPTEMBER 2016 Using the junction-to-foot thermal resistance characteristics of the PowerPAK SO-8 and the standard SO-8, the die temperature is determined to be 107 °C for the PowerPAK (and for DPAK) and 148 °C for the standard SO-8. ” Thermal metrics, such as qJA and qJC, are used to compare thermal performance of plastic IC packages. The JEDEC boards are horizontally mounted. The two results shown indicate the highest and the lowest test results. This industry standard package runs in very‐high volume and provides value added, low‐cost solutions for a wide range of applications. 36. Each board is made of FR4, is 1. 8-Lead MSOP = 205. Thermal Resistance Data Pin Count Package Type θ JA [°C/W] θ JC [°C/W] 8 SOIC 91. It takes advantage of advances in silicon that have facilitated smaller die for a given on-resistance, and creates an extensible family rather than looking for the next SOIC-8 package featuring half the thermal resistance of a standard SOIC-8 package. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. This is a low effect thermal conductivity test board. PowerPAK SO-8 minimizes the junction-to-board thermal resistance to where the MOSFET die temperature is very close to the temperature of the PC board. This type of package is also available with an improved die attach technology to achieve low thermal resistance. Table 42-1. 4. This column provides results on other thermal dissipation paths: RθJP [p] Through the exposed thermal pad (for related topic, see Application Note 26020, Procedure for Measuring Pad-to-Ambient Thermal Resistance (RθPA) for Exposed Pad Packages). Functional operation above the Recommended Operating Conditions is not implied. The benefit of the MIC5234 ePad SOIC-8 package is an improvement to less than half the thermal resistance over the standard SO-8 packing. The board temperature is measured on the top surface of the board near the package. It also reflects how heat flows into the external heat sink, making it relevant for packages used with external heat sinks. 6. Surface−mounted on FR4 board using 1 inch sq pad size, 1 oz Cu. High Density Power MOSFET with Ultra Low RDS(on) Providing Higher Efficiency Miniature SOIC−8 Surface Mount Package − Saves Board Space The following table summarizes the thermal resistance data depending on the package. Standard construction SO-8 thermal performance limited by heat dissipation through the leads and onto the PCB2 The junction-to-ambient thermal resistance, RθJA, is the most commonly reported thermal metric and is the most often misused. Maximum Ratings are stress ratings only. Power Packaging Solutions Historically, traditional SOIC packages such as SO-8 (see figure 1) have been adapted to power semiconductor use in microprocessor voltage regulation. 1 Thermal Resistance Data The following table summarizes the thermal resistance data depending on the package. This enables a lower junction-to-ambient thermal resistance (theta J/A) and better thermal performance than many QFN-style packages, like competitor A’s package in Figure 1. The maximum thermal resistance junction-to-ambient is 83 C/W for the single die and 125 C/W for dual-die parts. With the power dissipation and thermal resistance data the maximum ambient operating temperature can be predicted or, given the ambient operating temperature, a decision can be made as to the proper package for the LM3404HV. Surface−mounted on FR4 board using the minimum recommended pad size. THERMAL RESISTANCE RATINGS 3. . RDS(on) Higher Efficiency Extending Battery Life Logic Level Gate Drive Miniature Dual SOIC−8 Surface Mount Package Diode Exhibits High Speed, Soft Recovery Avalanche Energy Specified These Devices are Pb−Free and are RoHS Compliant SOIC SOIC (Small Outline IC Package) is a leadframe based, plastic encapsulated package that is well suited for applications requiring optimum performance in IC packaging. RθJA is a measure of the thermal performance of an IC package mounted on a specific test coupon. 8 21. RθJP and RθJT . THERMAL RESISTANCE RATINGS Stresses exceeding Maximum Ratings may damage the device. Peak repetitive pulsed power limits are determined by using the thermal response data in conjunction with the procedures discussed in AN569, “Transient Thermal Resistance − General Data and Its Use. TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS Gate Charge Test Circuit & Waveform This application note introduces a simple method to measure the thermal resistance from junction to ambi-ent for small SMT components in your design. Recent advancements in reporting of thermal data include standardized test-board The ePad SOIC-8 allows the device to dissipate approximately 50% more power than the SOIC-8 package. Additionally, the SOIC-8 on the LMR236xx family includes a single die attach pin (DAP) on the bottom to help extract the heat. 57 mm thick, and consists of 2 oz/ft copper traces on one or both of the exposed sur-faces. The IXDN604 is a dual non-inverting driver, the IXDI604 is a dual inverting driver, and the IXDF604 has one inverting driver and one non-inverting The IXD_604 family is available in a standard 8-pin DIP (PI), 8-pin SOIC (SIA), 8-pin Power SOIC with an exposed metal back (SI), and an 8-pin DFN (D2) package. Lower thermal resistance means more output current or higher input voltage for a given package size. The following table summarizes the thermal resistance data depending on the package. THERMAL RESISTANCE RATINGS 1. Thermal Resistance Data Package Type θ JA [°C/W] θ JC [°C/W] 14-pin SOIC150 (SVQ) 58 26 20-pin SOIC300 enable. 9°C/W 8-Lead SOIC = 157°C/W Junction-to-Case (θ JC) Thermal Resistance This measures ease of heat flow between the chip surface and the package surface. θ JC thermal resistance is measured in °C/W. The enhanced SOIC is designed for products with high power and high current requirements. Construction variations, such as die size, material, leads fused internally to Die Attach Pad, and PCB copper layout, significantly influence thermal performance. SOIC-8 package featuring half the thermal resistance of a standard SOIC-8 package. The intent of RθJA is to give a metric by which the relative thermal performance of a package can be compared. The thermal conductivity of all materials of the IC package and the test-board influence the thermal-resistance values reported by semiconductor manufacturers. Consider two devices mounted on a PC board heated to 105 °C by other components on the board (figure 8). Curves are based upon maximum peak junction temperature and a case temperature (TC) of 25°C. General PCB Pad Guidelines with SOIC SOICs are offered in industry standard sizes and thicknesses with various options of lead quantity and pitch. Table 36-2. Aug 28, 2025 · The package has a junction->board thermal resistance of 65K/W and junction->ambient resistance of 120K/W, and typical dissipation of 0. 25W at +/-15V supplies, giving a 16 degree rise if on a large copper area, about 25--30 degree rise if minimal PCB copper area. Junction-to-Board thermal resistance (Theta-JB or R JB per JEDEC JESD51-8) measures the horizontal spreading of heat between the junction and the board. TSSOP relies on a leadframe similar to LITTLE FOOT to remove heat from the package. klct5uqa4oactsiamtriq1kzzz9ivcguoy